Study on Boning of Hard and Brittle Materials to Metals (5th report) - Development of Low Temperature Bonding Technique for Joining Ceramic to Metals -

Authors=SAITOH Osamu, MIYAGAWA Wako, OSHIBA Katsuhiko

Journal/Book_names=Report of the Yamanashi Prefectural Industrial Technology Center

number=14

pages=36-39

Publish_year=2000

Publish_Country=JPN

Publisher=Yamanashi Prefectural Industrial Technology Center

Language_of_Text=JA

Language_of_Abs=JA, EN

ISSN=0914711X

ID=200012703