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Quantitative evaluation of microfracture due to disbonding by waveform analysis of acoustic emission
YUYAMA S., IMANAKA T., OHTSU M.
itemdescription
TitleQuantitative evaluation of microfracture due to disbonding by waveform analysis of acoustic emission
AuthorsYUYAMA S., IMANAKA T., OHTSU M.
Data nameJournal of the Acoustical Society of America
Volume83
Num3
Page976-981
Year1988
PublisherAcoustical Society of America
LanguageEN
Abstract languageEN
ISSN00014966
DOI10.1121/1.395975
@idhttps://gbank.gsj.jp/ld/resource/geolis/198808234